PCBA Technology Roadmap
| SMT |
Position accuracy：20 um |
| Components size：0.4×0.2mm(01005) —130×79mm，Flip-CHIP,QFP,BGA,POP |
| Max. component height:：25mm |
| Max. PCB size：680×500mm |
| Min. PCB size：no limited |
| PCB thickness：0.3 to 6mm |
| PCB weight：3KG |
| Wave-Solder |
Max. PCB width：450mm |
| Min. PCB width: no limited |
| Component height：Top 120mm/Bot 15mm |
| Sweat-Solder |
Metal type ：part, whole, inlay, sidestep |
| Metal material：Copper , Aluminum |
| Surface Finish：plating Au, plating sliver , plating Sn |
| Air bladder rate：less than20% |
| Press-fit |
Press range：0-50KN |
| Max. PCB size：800X600mm |
| Testing |
ICT，Probe flying，burn-in，function test，temperature cycling |
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