|
|
Standard
|
Advanced
|
Emerging
|
|
Panel Size
|
508 X 622 mm
|
1150 X 560 mm
|
1150 X560 mm
|
|
Layer Count
|
1 to 58
|
64+
|
64+
|
|
Laminate Materials
|
|
|
|
|
FR4 Tg 140
|
Yes
|
Yes
|
Yes
|
|
FR4 Tg 170
|
Yes
|
Yes
|
Yes
|
|
Bergquist
|
Yes
|
Yes
|
Yes
|
|
Rogers
|
Yes
|
Yes
|
Yes
|
|
Polyimide
|
Yes
|
Yes
|
Yes
|
|
Nelco
|
Yes
|
Yes
|
Yes
|
|
RoHs Materials
|
Yes
|
Yes
|
Yes
|
|
Polyclad 370 HR
|
Yes
|
Yes
|
Yes
|
|
Isola 410
|
Yes
|
Yes
|
Yes
|
|
Stablcor
|
Yes
|
Yes
|
Yes
|
|
Halogen Free
|
Yes
|
Yes
|
Yes
|
|
TUC
|
Yes
|
Yes
|
Yes |
|
Exotic Material Types
|
Yes
|
52+
|
60+
|
|
Finished Thickness [Multilayer]
|
0.13 to 10 mm
|
0.13 to 17.50 mm
|
Greater than 17.50 mm
|
|
Minimum Core Thickness
|
0.075 mm
|
0.075 mm
|
0.05 mm
|
|
Finished Thickness Tolerance [+/-]
|
10%
|
7%
|
5%
|
|
Multiple Laminations
|
9
|
12
|
15+
|
|
Copper Foil Weights Internal
|
1/3 to 6
|
Up to 12 ounce
|
Up to 8 ounce
|
|
Copper Foil Weights External
|
1/7 to 6
|
Up to 12 ounce
|
Greater than 12 ounce
|
|
Lines, Spaces & Pad Diameters
|
|
|
|
|
Internal Line Width
|
0.05 mm
|
0.05 mm
|
Less than 0.05 mm
|
|
Internal Spacing
|
0.075 mm
|
0.05 mm
|
Less than 0.05 mm
|
|
External Line Width
|
0.075 mm
|
0.05 mm
|
Less than 0.05 mm
|
|
External Spacing
|
0.075 mm
|
0.05 mm
|
Less than0.05 mm
|
|
Int. Pad Size-A/R Per Side (Fin.-.001)
|
0.127 mm
|
0.10 mm
|
Less than0.10mm
|
|
Ext. Pad Size-A/R Per Side (Fin.-.002)
|
0.075mm
|
0.075mm
|
Less than 0.075mm
|
|
SMT Pitch
|
0.20 mm
|
0.20 mm
|
Less than 0.20 mm
|
|
Impedance
|
10%
|
5%
|
Greater than 5%
|
|
Electroplating
|
|
|
|
|
Tin Lead Plating Thickness
|
0.008-0.013 mm
|
Greater than 0.013 mm
|
Greater than 0.013 mm
|
|
Tin Nickel Plating Thickness
|
150Microinches
|
250 Microinches
|
Greater than 250 Microinches
|
|
Low Stress Nickel
|
100 Microinches
|
250 Microinches
|
Greater than 250 Microinches
|
|
Gold Plating Thickness
|
30 Microinches
|
As Specified
|
As Specified
|
|
Minimum Drilled Hole Size
|
0.12
|
0.15
|
Less than0.15
|
|
Hole Aspect Ratio
|
18 to 1
|
18 to 1
|
Less than 20 to 1
|
|
Conductor Finishes
|
|
|
|
|
HASL
|
Yes
|
Yes
|
Yes
|
|
Solder with Reflow
|
Yes
|
Yes
|
Yes
|
|
White Tin
|
Yes
|
Yes
|
Yes
|
|
Carbon Ink
|
Yes
|
Yes
|
Yes
|
|
Lead Free Finishes
|
|
|
|
|
Electroless Nickel/Paladium/Gold
|
Yes |
Yes
|
Yes |
|
Electroless Nickel/Immersion Gold
|
Yes
|
Yes
|
Yes
|
|
Immersion Gold
|
Yes
|
Yes
|
Yes
|
|
Immersion Silver
|
Yes
|
Yes
|
Yes |
|
106A HT
|
Yes
|
Yes
|
Yes
|
|
HASL
|
Yes
|
Yes
|
Yes
|
|
Tolerances
|
|
|
|
|
Drilled Hole To Copper
|
0.20 mm
|
0.18 mm
|
0.15 mm
|
|
Non Plated Hole Tolerances [+/-]
|
0.025 mm
|
0.025 mm
|
Less than 0.025 mm
|
|
Fabrication Tolerances [+/-]
|
0.13 mm
|
0.075 mm
|
Less than 0.075 mm
|
|
Via Capabilities
|
|
|
|
|
Laser Micro Vias
|
0.10 mm
|
0.05 mm
|
Less than 0.05 mm
|
|
Blind/Buried Vias
|
0.01 mm
|
0.05 mm
|
Less than 0.05 mm
|
|
Via Under PAD
|
Yes
|
Yes
|
Yes
|
|
Castellation
|
Yes
|
Yes
|
Yes
|
|
Laser Drill
|
0.10 mm
|
0.05 mm
|
Less than 0.05 mm
|
|
Mechanical Vias
|
0.15 mm
|
0.12 mm
|
Less than 0.12 mm
|
|
Tented LPI
|
Coated With LPI
|
Coated/plugged
|
Coated/plugged
|
|
Plugged UV Curable [no solvent]
|
Maximum 0.50 mm
|
Yes
|
Yes
|
|
Silver Conductive Via Fill
|
Yes
|
Yes
|
Yes
|
|
Non-Conductive ViaFill
|
Yes
|
Yes
|
Yes
|
|
Soldermask and Legend
|
|
|
|
|
Minimum Mask Clearance [LPI]
|
0.075 mm
|
0.05 mm
|
Less than 0.05 mm
|
|
MinimumSoldermask Thickness
|
0.01 mm
|
0.01 mm
|
0.01 mm
|
|
Gasketed Chip Scale Packaging
|
0.05 mm
|
0.025 mm
|
Less than 0.025 mm |
|
Soldermask Type
|
LPI
|
Dry Film
|
As required
|
|
Soldermask Color
|
Green
|
Any Color
|
Any Color
|
|
Soldermask Web Minimum
|
0.10 mm
|
0.075 mm
|
Less than 0.075 mm
|
|
Legend Color
|
White
|
Any Color
|
Any Color
|
|
Legend Feature Size
|
0.20 mm wide x 0.75 mm high
|
0.15 mm wide x 0.75 mm high min
|
LPI Legend 0.075 mm x 0.50 mm
|
|
Flatness (Symmetrical construction)
|
IPC Standard
|
Review Required
|
Review Required
|
