PCB Technology Roadmap

Layers	Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness	Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material	FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,  PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing	Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness	Mass production: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size	Mechanical drill: 6mil（0.15mm）  Laser drill: 3mil（0.075mm）
Max. Panel Size	1150mm × 560mm
Aspect Ratio	18：1
Surface Finish	HASL、Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process	Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.