FPCB Technology Roadmap
Item
|
Capability |
Min
trace
width& space
|
Single side
|
0.038 & 0.038 mm ( 1.5 mil
& 1.5 mil )
|
Double side
|
0.050 & 0.050 mm ( 2 mil & 2 mil )
|
COF Chip on Flex
|
0.02 & 0.02 mm ( 0.8 mil & 0.8 mil )
|
Min Hole size
|
CNC Drilling
|
0.15 mm ( 6mi l)
|
Punching Hole
|
0.5 mm ( 20 mil )
|
Multi-layer FPC
Max Layer
|
12 Layer |
Rigid-flex FPC Max
Layer |
Mass production: 16 layers / Pilot run: 22 layers |
Item
|
Capability |
SMT Capability |
Connector |
Min Pitch 0.4 mm |
Passive Component
|
Min0201 |
IC Bonding Capability
|
Min Pitch 40 um ( 1.6 mil ) |
Surface
finish
|
Tin/Lead Electroplating |
H.A.L |
Immersion Tin |
Hard Gold Electroplating |
Soft Gold Electroplating |
Immersion Gold |
O.S.P |
General Tolerance |
Item |
Capability |
Conduct Width
|
General |
Special |
+/-
0.05 mm
|
+/- 0.03 mm |
Hole Diameter
|
+/-
0.1 mm |
+/- 0.05 mm |
Outline Dimension
|
+/- 0.3 mm |
+/- 0.1 mm |
Accumulated Pitch
|
+/-
0.1 mm
|
+/- 0.05 mm |
Punching |
Hole to Hole
|
+/- 0.1 mm
|
+/- 0.05 mm |
Hole to Outline Edge
|
+/- 0.15 mm
|
+/- 0.07 mm |
Center of Conduct to Outline
Edge
|
+/- 0.15 mm
|
+/- 0.07 mm |
Roundness
|
+/- 0.1 mm |
|
General Tolerance |
Item |
Capability |
Assembly
Accuracy
|
Coverlay Pre-lamination
|
General
|
Special |
PSA Assembly
|
+/- 0.5 mm
|
+/- 0. 3 mm |
Stiffener Assembly
|
+/- 0. 5 mm
|
+/- 0. 3 mm |
Fold Assembly
|
+/- 0. 5 mm
|
|
Gold finger Exposure Area
|
+/- 0. 5 mm
|
+/- 0. 3 mm |
General Tolerance |
Item |
Capability |
Silk Screen
Thickness |
|
General |
Special |
Silver Paste
|
5-15
um
|
|
Solder Mask
|
10-20 um |
|
ZIF Area
|
+/- 0.05 mm
|
+/- 0.03 mm |
FPC Thickness
|
+/- 0.05 mm
|
+/- 0.03 mm |
Reliability |
Item |
Capability |
Peeling Strength
|
IPC-TM-650 2 . 4 . 9 |
Flexible Endurance |
JIS C50168 . 7 |
Bending Resistance
|
IPC-TM-650 2 . 4 . 3
JIS C6013 |
Open-Close Lifetime
|
0~150℃ , 20 time/minute
Based on Customer’s Requirement |
Reliability |
Item |
Capability |
Metal Dome Life Test
|
Force : 120g , 180 time/minute
Based on Customer’s Requirement |
Solder Float Resistance
|
IPC-TM-650 2 . 4 . 13 |
Dimensional Resistance
|
IPC-TM-650 2 . 2 . 4 |
Resin Flow
|
IPC-TM-650 2 . 3 . 17 |
Reliability |
Item |
Capability |
Thermal Shock
|
IPC-TM-650 2 . 6 . 7 |
Chemical Resistance
|
IPC-TM-650 2 . 6 . 3
JIS C5016 7 . 6 |
Insulation Resistance
|
IPC-TM-650 2 . 6 . 3
JIS C5016 7 . 6 |
Withstanding Voltage
|
IPC-TM-650 2 . 5 . 7 |
Salt Spray
|
IEC 68-2-11 |
|
|